The Secrets of PC Memory: Part 2

Written by Ryan J. Leng

December 17, 2007 | 08:10

Tags: #article #chip #ddr #ddr2 #ddr3 #information #packaging #power #refresh #secrets #technical #technology

The following are some of the stacking methods used to increase density per module:

The Secrets of PC Memory: Part 2 Stacking Technology Continued
TSOP DRAM Stacking
Source: STEC


The Secrets of PC Memory: Part 2 Stacking Technology Continued
Module Stacking
Source: Kingston Memory (modified for clarity)


The Secrets of PC Memory: Part 2 Stacking Technology Continued
Proprietary BGA Stacking
Source: Tessera


The Secrets of PC Memory: Part 2 Stacking Technology Continued
TSOP Tape Carrier Package stacking technique Chip is placed on a tape with its reverse face exposed.
Source: Elpida Memory

An interesting technique called “Folded Printed Circuit Board” is used by SMART Modular Technologies with its CoolFlex DDR2 2GB low profile module. It uses a folded PCB technology to double the memory capacity and eliminate the need for stacked or multi-die DRAMs. It is a relatively cost effective method when compared to more complex multi-die stacking technique.

The Secrets of PC Memory: Part 2 Stacking Technology Continued
Very Low Profile 2GB DDR2 with Folded Printed Circuit Board
Source: SMART Modular Technologies

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