Enermax has announced the impending launch of a redesigned ETS-N30 tower heatsink, imaginatively dubbed the ETS-N30-II, with what it claims is improved performance and the ability to cool processors up to a 150W thermal design profile (TDP).
Designed for micro-ATX and mini-ITX systems with limited clearance for RAM modules, the ETS-N30-II has its three 6mm heatpipes laid out in an asymmetrical fashion which pushes the body of the heatsink towards the rear IO area of the motherboard - meaning, the company claims, complete compatibility with even the largest of RAM modules on even the smallest of motherboards. Coupled with a 137.2mm overall height, the company is clearly pushing the new model for those with high-performance processors in more cramped cases.
To keep chips cool, Enermax has put a pair of its patented designs into the ETS-N30-II: the Vortex Generator Flow design redirects airflow through the rear side of the heatpipes, which traditionally sit in a dead zone without active cooling, while the Vacuum Effect Flow system claims to pull additional cool air in by producing a low-pressure zone around the heatsink's fin stack.
The company has confirmed two launch models for the ETS-N30-II: the ETS-N30R-TAA will include the company's Twister Bearing LED fan featuring 12 blue LEDs, while the ETS-N30R-HE swaps this out for a plain black fan with the added bonus of a bundled speed-reducing adapter to drop the stock 800-2,800rpm rotational speed down to 600-1,800rpm. Either fan attaches using the a one-clip bracket, which includes rubber to reduce vibration.
The new ETS-N30-II heatsinks are due to hit the UK channel in the first quarter of 2016, with pricing yet to be confirmed. More information is available on the official product page