Leaked slides have detailed the improvements that Intel's Skylake microarchitecture will bring over current-generation Broadwell parts, claiming a 10-20 per cent CPU boost and an impressive 50 per cent more 3D graphics grunt.
Intel's next 14nm design, Skylake's details have been leaked in a series of slides published by FanlessTech and claiming to be internal Intel documentations leaked from within the company. If the claims are true, Skylake is set to bring a 50 per cent boost to the performance of its integrated graphics, as measured using an unspecified 45W Skylake part featuring Intel's next-generation GT4e graphics processor and running 3DMark Vantage. That, the slides claim, is to be joined by a 10-20 per cent boost to single- and multi-threaded performance.
The same slides also claim that systems built around Skylake's low-power Y-series parts will enjoy a 30 per cent better battery life as tested during HD video playback, additional integrated IO for tablet devices including native CSI2, USB On-The-Go (OTG) and eMMC5.0 ports, and for the portable crowd support for the latest Widi 6.0 wireless display standard, Cat6 Long Term Evolution (LTE) connectivity, and Bluetooth 4.1, along with A4WP wireless charging support.
The same slide decks, which contain formatting errors that may indicate that they are less than genuine but which nevertheless claim little that hasn't already been suspected, claim support for High-Efficiency Video Codec (HEVC) decode and encode in hardware, the expansion of Intel's RealSense user-facing 3D camera system into a world-facing model, enhanced digital signal processing for the audio subsystem include hardware-accelerated speech recognition and wake-on-voice support, along with integrated touch and sensor hubs - though these latter features are described as 'still under planning and not a platform POR.'
The biggest gains, a final slide claims, will come to the Y-series chips with 17 per cent better CPU performance, 41 percent faster graphics performance, and a 1.4 hour battery life boost; the U-series will see 10 per cent and 34 per cent CPU and graphics boosts respectively along with the same battery-life gains; while the H-series will get an 11 per cent and 16 per cent boost along with the claim of an 80 per cent lower silicon power draw thanks to the higher levels of integration. Finally, the S-series desktop parts will gain a claimed 11 per cent CPU performance, 22 per cent lower thermal design profile, and 28 per cent graphics performance.
Intel, as is to be expected, has not commented on the veracity of the slides.
Intel's next 14nm design, Skylake's details have been leaked in a series of slides published by FanlessTech and claiming to be internal Intel documentations leaked from within the company. If the claims are true, Skylake is set to bring a 50 per cent boost to the performance of its integrated graphics, as measured using an unspecified 45W Skylake part featuring Intel's next-generation GT4e graphics processor and running 3DMark Vantage. That, the slides claim, is to be joined by a 10-20 per cent boost to single- and multi-threaded performance.
The same slides also claim that systems built around Skylake's low-power Y-series parts will enjoy a 30 per cent better battery life as tested during HD video playback, additional integrated IO for tablet devices including native CSI2, USB On-The-Go (OTG) and eMMC5.0 ports, and for the portable crowd support for the latest Widi 6.0 wireless display standard, Cat6 Long Term Evolution (LTE) connectivity, and Bluetooth 4.1, along with A4WP wireless charging support.
The same slide decks, which contain formatting errors that may indicate that they are less than genuine but which nevertheless claim little that hasn't already been suspected, claim support for High-Efficiency Video Codec (HEVC) decode and encode in hardware, the expansion of Intel's RealSense user-facing 3D camera system into a world-facing model, enhanced digital signal processing for the audio subsystem include hardware-accelerated speech recognition and wake-on-voice support, along with integrated touch and sensor hubs - though these latter features are described as 'still under planning and not a platform POR.'
The biggest gains, a final slide claims, will come to the Y-series chips with 17 per cent better CPU performance, 41 percent faster graphics performance, and a 1.4 hour battery life boost; the U-series will see 10 per cent and 34 per cent CPU and graphics boosts respectively along with the same battery-life gains; while the H-series will get an 11 per cent and 16 per cent boost along with the claim of an 80 per cent lower silicon power draw thanks to the higher levels of integration. Finally, the S-series desktop parts will gain a claimed 11 per cent CPU performance, 22 per cent lower thermal design profile, and 28 per cent graphics performance.
Intel, as is to be expected, has not commented on the veracity of the slides.
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