Details of Intel's plans for its Next Unit of Computing (NUC) devices following the launch of Broadwell processors have leaked ahead of an official announcement, offering a glimpse of what will launch towards the end of the year.
According to slides obtained by the guys over at FanlessTech, the first Broadwell-equipped NUC boards will appear in the last quarter of the year in both bare-bones consumer and bare-board commercial variants. Both will include Broadwell-based processors, Intel's next-generation replacement for its current Haswell architecture.
According to the slides, the consumer kits will come in Core i5 and Core i3 variants, both based on the Rock Canyon design. Compared to the existing Wilson Canyon design used in existing NUC kits, Rock Canyon promises support for both 2.5" SATA and M.2 solid-state storage devices replacing the existing mSATA connectivity, built-in and non-optional Wi-Fi and Bluetooth connectivity and next-generation integrated graphics processing capabilities with boosted performance in both GPU and CPU activity. The commercial variant, meanwhile, uses a design dubbed Maple Canyon and offers enterprise-grade features including Intel vPro and an on-board Trusted Platform Module (TPM) unit.
Perhaps the most interesting feature for both consumer and commercial kit-form models, however, comes in replaceable lids which add new functionality: one lid adds in a Near-Field Communication (NFC) radio unit, while another gives the Rock Canyon variants support for wireless charging of mobile devices simply by placing them on top of the case.
From Intel's roadmap, only the commercial Maple Canyon variants will be available as bare-board models with those opting for the consumer variant being restricted to buying the kit-form bare-bones systems with bundled case. No pricing has been provided.
Intel, as is common for the company, has not commented on the leak.
According to slides obtained by the guys over at FanlessTech, the first Broadwell-equipped NUC boards will appear in the last quarter of the year in both bare-bones consumer and bare-board commercial variants. Both will include Broadwell-based processors, Intel's next-generation replacement for its current Haswell architecture.
According to the slides, the consumer kits will come in Core i5 and Core i3 variants, both based on the Rock Canyon design. Compared to the existing Wilson Canyon design used in existing NUC kits, Rock Canyon promises support for both 2.5" SATA and M.2 solid-state storage devices replacing the existing mSATA connectivity, built-in and non-optional Wi-Fi and Bluetooth connectivity and next-generation integrated graphics processing capabilities with boosted performance in both GPU and CPU activity. The commercial variant, meanwhile, uses a design dubbed Maple Canyon and offers enterprise-grade features including Intel vPro and an on-board Trusted Platform Module (TPM) unit.
Perhaps the most interesting feature for both consumer and commercial kit-form models, however, comes in replaceable lids which add new functionality: one lid adds in a Near-Field Communication (NFC) radio unit, while another gives the Rock Canyon variants support for wireless charging of mobile devices simply by placing them on top of the case.
From Intel's roadmap, only the commercial Maple Canyon variants will be available as bare-board models with those opting for the consumer variant being restricted to buying the kit-form bare-bones systems with bundled case. No pricing has been provided.
Intel, as is common for the company, has not commented on the leak.
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