VIA returns to Las Vegas to turn the spotlight on brilliant new products enabled by its VIA C7, power efficient x86 processors
Taipei, Taiwan, 2 January 2008 - VIA Technologies, Inc, a leading innovator and developer of silicon chip technologies and PC platform solutions, today announced it will participate in the annual Lunch@Piero's press event, to be held during CES in Las Vegas on January 7th and 8th. Attendees at Lunch@Piero’s will be able to see a host of high performance ultra mobile devices (UMDs), eco-friendly PCs, and power efficient embedded systems all made possible through VIA's extensive expertise in platform miniaturization and designed for a new digital world where Small is Beautiful.
Leading edge partner systems being demonstrated at this event include UMDs from OQO, WiBrain, TabletKiosk, Packard Bell and Solpi, as well as VIA’s own popular mini-note reference design, the VIA NanoBook. There’ll also be innovative new takes on the PC in the form of the award-winning Zonbu Mini, and the ultra thin, fanless vmpc vm7700 together with the eagerly anticipated MTube – a groundbreaking five-ounce Internet Media Player (IMP) developed by the Taiwan Government's Science and Technology Advisory Group and based on the new VIA Mobile-ITX motherboard.
Additionally, VIA will demo both its Nano-ITX and Pico-ITX motherboards, including the hugely popular ARTiGO Builder Kit, based on the VIA EPIA PX Pico-ITX mainboard. To showcase some of the possibilities these new small form factor boards provide, two case-mods by Jeffrey Stephenson, one using the Nano-ITX, the other the Pico-ITX, will be on display. Rounding out the demos are exciting digital signage systems from Danoo and a remarkable in-car PC system from CTT.
“VIA’s “Small is Beautiful” technology design strategy of shrinking the form factor and power draw of the x86 platform has resulted in some amazing new products and device categories,” said Richard Brown, Vice President of Corporate Marketing, VIA Technologies, Inc. “Lunch@Piero’s gives the press an opportunity to view these devices first-hand, and offers a glimpse into the future of PC, ultra mobile and embedded computing technology.”
More information on the Lunch@Piero’s event can be found on the VIA website at: http://www.via.com.tw/en/company/events/ces2008/index.jsp
About Lunch@Piero’s
For the past 22 years, Lunch@ events organized by Pat Meier Associates have brought innovative technology companies and typically more than 300 reporters and industry pundits together for a fine productive working lunch, resulting in print and broadcast coverage that has reached around the world.
For more information please go to www.lunchat.com
About VIA Technologies, Inc.
VIA Technologies, Inc. (TSE 2388) is the foremost fabless supplier of market-leading core logic chipsets, low power x86 processors, advanced connectivity, multimedia and networking silicon, and complete platform solutions that are driving system innovation in the PC and embedded markets. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs, motherboard vendors and system integrators. www.via.com.tw
Taipei, Taiwan, 2 January 2008 - VIA Technologies, Inc, a leading innovator and developer of silicon chip technologies and PC platform solutions, today announced it will participate in the annual Lunch@Piero's press event, to be held during CES in Las Vegas on January 7th and 8th. Attendees at Lunch@Piero’s will be able to see a host of high performance ultra mobile devices (UMDs), eco-friendly PCs, and power efficient embedded systems all made possible through VIA's extensive expertise in platform miniaturization and designed for a new digital world where Small is Beautiful.
Leading edge partner systems being demonstrated at this event include UMDs from OQO, WiBrain, TabletKiosk, Packard Bell and Solpi, as well as VIA’s own popular mini-note reference design, the VIA NanoBook. There’ll also be innovative new takes on the PC in the form of the award-winning Zonbu Mini, and the ultra thin, fanless vmpc vm7700 together with the eagerly anticipated MTube – a groundbreaking five-ounce Internet Media Player (IMP) developed by the Taiwan Government's Science and Technology Advisory Group and based on the new VIA Mobile-ITX motherboard.
Additionally, VIA will demo both its Nano-ITX and Pico-ITX motherboards, including the hugely popular ARTiGO Builder Kit, based on the VIA EPIA PX Pico-ITX mainboard. To showcase some of the possibilities these new small form factor boards provide, two case-mods by Jeffrey Stephenson, one using the Nano-ITX, the other the Pico-ITX, will be on display. Rounding out the demos are exciting digital signage systems from Danoo and a remarkable in-car PC system from CTT.
“VIA’s “Small is Beautiful” technology design strategy of shrinking the form factor and power draw of the x86 platform has resulted in some amazing new products and device categories,” said Richard Brown, Vice President of Corporate Marketing, VIA Technologies, Inc. “Lunch@Piero’s gives the press an opportunity to view these devices first-hand, and offers a glimpse into the future of PC, ultra mobile and embedded computing technology.”
More information on the Lunch@Piero’s event can be found on the VIA website at: http://www.via.com.tw/en/company/events/ces2008/index.jsp
About Lunch@Piero’s
For the past 22 years, Lunch@ events organized by Pat Meier Associates have brought innovative technology companies and typically more than 300 reporters and industry pundits together for a fine productive working lunch, resulting in print and broadcast coverage that has reached around the world.
For more information please go to www.lunchat.com
About VIA Technologies, Inc.
VIA Technologies, Inc. (TSE 2388) is the foremost fabless supplier of market-leading core logic chipsets, low power x86 processors, advanced connectivity, multimedia and networking silicon, and complete platform solutions that are driving system innovation in the PC and embedded markets. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs, motherboard vendors and system integrators. www.via.com.tw
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