CES Innovations Award 2009: Big Recommendations on Thermaltake Spedo Continues
November 12, 2008 | 18:23
Companies: #thermaltake
Taipei, Taiwan, November 12, 2008 – The eye-catching sports car styled chassis, Spedo from Thermaltake is receiving endless recommendations around the world. Thermaltake announced again today, that it has received the 2009 CES Innovations Award as earlier announced by the organization officially at: www.CESweb.org/Innovations
Since the first product exposure in June this year, Spedo has been expected to reform the global PC chassis market. It is the 2008 masterpiece of the famous Thermaltake engineering and technical skills. The unique style and structure of Spedo was inspired by the design of European sports cars; offering superior aerodynamics, Thermaltake Spedo was created to satisfy your hunger for the perfect integration of style and enhanced ventilation with user convenience!
It is not just the stylish expression of Spedo that spoke for the product; it is also the unique internal structure that made it shine out from other PC cases on the market:
C.R.M.3 – Cable Routing Management 3, arranging cables with exclusive plastic covers behind the motherboard, this provides a well-organized internal setting to boost up the air circulation with no messy cable blockage.
A.T.C.3 – Advance Thermal Chamber 3, following the concept of automotive engine bay designs, the internal structure of SPEDO has been separated into 3 chambers, isolating the CPU, GPU and PSU areas by specially made partitions.
Fancool 8, capability of up to 8 fans support; including the 23cm fans at top and side panel that further enhance the system airflow.
After many media recommendations, the CES 2009 Innovations Award announced today has proved the design and engineering excellence of Thermaltake Spedo. It will be displayed at the 2009 International CES, which runs January 8-11, 2009 in Las Vegas, Nevada. The Innovations Design and Engineering Showcase will feature honorees by product category at the Sands Expo and Convention Center/The Venetian, Booth #72062. Best of Innovations honoree products will also be displayed at the Grand Lobby of the Las Vegas Convention Center, next to Experience CEA and at CES Unveiled: The Official Press Event of the International CES on Tuesday, January 6.
Thermaltake new SPEDO series is aggressively innovative in style and design, satisfaction from the product performance and ownership can be easily expected. Read More about the case on its exclusive website at: 59.124.46.66/product/Chassis/fulltower/spedo/index.html
About Thermaltake
Thermaltake Incorporation, based in Taipei, Taiwan is the global leader Thermal Solution and Thermal Management for PC & Industrial Market. Its engineering staffs master in Airflow Analysis, Material Conductivity and Heat Dissipation Efficiency. Thermaltake offers a wide range of products and services, providing effective and cost-conscious cooling devices. The Company has more than 1,000 employees worldwide supporting customers from its headquarters in Taipei, Taiwan, as well as from offices in China, Europe and United States Continent.
Since the first product exposure in June this year, Spedo has been expected to reform the global PC chassis market. It is the 2008 masterpiece of the famous Thermaltake engineering and technical skills. The unique style and structure of Spedo was inspired by the design of European sports cars; offering superior aerodynamics, Thermaltake Spedo was created to satisfy your hunger for the perfect integration of style and enhanced ventilation with user convenience!
It is not just the stylish expression of Spedo that spoke for the product; it is also the unique internal structure that made it shine out from other PC cases on the market:
C.R.M.3 – Cable Routing Management 3, arranging cables with exclusive plastic covers behind the motherboard, this provides a well-organized internal setting to boost up the air circulation with no messy cable blockage.
A.T.C.3 – Advance Thermal Chamber 3, following the concept of automotive engine bay designs, the internal structure of SPEDO has been separated into 3 chambers, isolating the CPU, GPU and PSU areas by specially made partitions.
Fancool 8, capability of up to 8 fans support; including the 23cm fans at top and side panel that further enhance the system airflow.
After many media recommendations, the CES 2009 Innovations Award announced today has proved the design and engineering excellence of Thermaltake Spedo. It will be displayed at the 2009 International CES, which runs January 8-11, 2009 in Las Vegas, Nevada. The Innovations Design and Engineering Showcase will feature honorees by product category at the Sands Expo and Convention Center/The Venetian, Booth #72062. Best of Innovations honoree products will also be displayed at the Grand Lobby of the Las Vegas Convention Center, next to Experience CEA and at CES Unveiled: The Official Press Event of the International CES on Tuesday, January 6.
Thermaltake new SPEDO series is aggressively innovative in style and design, satisfaction from the product performance and ownership can be easily expected. Read More about the case on its exclusive website at: 59.124.46.66/product/Chassis/fulltower/spedo/index.html
About Thermaltake
Thermaltake Incorporation, based in Taipei, Taiwan is the global leader Thermal Solution and Thermal Management for PC & Industrial Market. Its engineering staffs master in Airflow Analysis, Material Conductivity and Heat Dissipation Efficiency. Thermaltake offers a wide range of products and services, providing effective and cost-conscious cooling devices. The Company has more than 1,000 employees worldwide supporting customers from its headquarters in Taipei, Taiwan, as well as from offices in China, Europe and United States Continent.
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