VIA Launches Stackable Multi-Story Chassis for VIA EPIA Boards
VIA AMOS-1000 and VIA AMOS-2000 chassis use unique stackable and modular designs for Mini-ITX and Nano-ITX-based industrial SBCs
Taipei, Taiwan, 27 August 2009 - VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced its latest additions to the VIA AMOS series of universal chassis products; the VIA AMOS-1000 and VIA AMOS-2000 chassis are specially designed to work with VIA EPIA Mini-ITX and Nano-ITX boards and feature unique multi-story stackability.
VIA developed the VIA AMOS-1000 and VIA AMOS-2000 chassis to make complete system design as straightforward and expedient as possible. The guiding principle behind the VIA AMOS-1000 and VIA AMOS-2000 is the ability to add additional layers to the chassis, facilitating simple system expansion for optical drives, system storage and PCI or PCI Express AIBs.
“The expansion of our VIA AMOS chassis series to include Mini-ITX and Nano-ITX products is something that we are certain our customers will appreciate,” said Daniel Wu, Vice President, VIA Embedded Platform Division, VIA Technologies, Inc. “These new chassis designs offer a comprehensive feature set that can be easily sculpted into a wide variety of application specific designs.”
The VIA AMOS-1000 and VIA AMOS-2000 chassis designs are ideal for a wide range of industrial and commercial applications including digital signage, healthcare, industrial control and automation, kiosk, POI/POS, gaming and surveillance. The modular and fully customizable nature of these chassis designs means that customers can bring products to market faster, using fewer resources. All VIA AMOS chassis are designed to be user friendly, making system maintenance as simple as possible.
The VIA AMOS-1000 Mini-ITX Chassis
The VIA AMOS-1000 is specially designed to work with VIA’s extensive range of VIA EPIA Mini-ITX boards. The VIA AMOS-1000 in a basic configuration involves a main system chassis that contains a VIA EPIA Mini-ITX board, 2.5” hard disk with a DC to DC power board and optional companion boards including wireless, COM, DVI and USB boards. These companion boards provide additional I/O on the reverse of the chassis.
This basic chassis configuration can be supplemented with additional layers, including an ultra thin storage chassis that can support an slimline optical storage drive, as well as a Compact Flash slot, MiniPCI port and two additional S-ATA II 2.5” hard drives. This storage module takes the potential storage capacity of a VIA AMOS-1000 system to a theoretical max of 3TB.
The VIA AMOS-1000 also supports a riser expansion chassis that adds support for up to two PCI or PCI Express add-in-boards; offering multitude of I/O options that include high-end discrete graphics and video support, networking I/O or a plethora of other application-centered configurations.
For more information about the VIA AMOS-1000 please visit:
Images of the VIA AMOS-1000 can be found here:
The VIA AMOS-2000 Nano-ITX Chassis
The VIA AMOS-2000 measures a mere 19 cm x 19 cm x 6 cm and is designed to work specifically with VIA EPIA Nano-ITX boards, in a range of compact IPC applications. The main chassis comes with a customized front I/O panel, specifically suited to work with EPIA Nano-ITX boards and their respective I/O configurations.
The VIA AMOS-2000 also supports a range of companion cards in its main chassis, with dual sided I/O providing additional wireless, COM, DVI and USB support on the rear panel. The VIA AMOS-2000 also uses an additional ultra thin storage chassis, adding support for an optical storage drive.
For more information about the VIA AMOS-2000 please visit:
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About VIA Technologies, Inc.
VIA Technologies, Inc is the foremost fabless supplier of power efficient x86 processor platforms that are driving system innovation in the PC, client, ultra mobile and embedded markets. Combining energy-saving processors with digital media chipsets and advanced connectivity, multimedia and networking silicon enables a broad spectrum of computing and communication platforms, including its widely acclaimed ultra compact mainboards. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs and system integrators. www.via.com.tw