The VIA AMOS-3000: The Strong, Silent Type of Industrial PC
February 25, 2009 | 10:28
Companies: #via
Designed to take industrial environments in its stride, the hand-sized VIA AMOS-3000 is the first Pico-ITX fanless embedded box computer
Taipei, Taiwan, 25 February 2009 - VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the launch of VIA’s first embedded box computer; the VIA AMOS-3000. Ideal for a variety of embedded applications, the VIA AMOS-3000 is a robust, custom-designed system based on the ultra compact and versatile VIA EPIA-P700 Pico-ITX board.
Inspired by classical Chinese architecture, the VIA AMOS-3000 chassis combines heavy-duty steel, aluminum and copper in a unique heat fin design that offers superb heat dissipation. Using a total of only five mechanical pieces - top cover, bottom plate, front and rear I/O access plates and DOM module – and measuring only 13.5cm(w) x 4.5cm(h) x 13.1cm(d), the VIA AMOS-3000 is strong, durable and heat efficient, yet tiny enough to fit in the palm of your hand. The VIA AMOS-3000 can be installed easily using simple table, wall and VESA mounting options.
The VIA AMOS-3000 is a complete system that uses no moving parts, making it an excellent choice for mission-critical applications in harsh industrial environments, while the full featured VIA EPIA Pico-ITX board is ideal for a range of x86 applications including gaming, digital signage, industrial automation and in-car entertainment.
“We have drawn on the strength of our engineering expertise in developing our boards and form factors and taken the step of developing our own custom-designed systems. This has allowed us to produce some truly compelling embedded system designs,” said Daniel Wu, Vice President, VIA Embedded Platform Division, VIA Technologies, Inc. “The VIA AMOS-3000 represents the first of many diverse embedded system products based around our own exclusive range of EPIA boards.”
The VIA AMOS-3000 will be on show at Embedded World 2009, March 3-5 at the Exhibition Center Nuremberg, Hall 12, No. 350. For more details about VIA’s involvement at Embedded World 2009 please visit: www.via.com.tw/en/company/events/2009-ew/index.jsp
About the VIA AMOS-3000
The VIA AMOS-3000 is based on a VIA EPIA-P700 Pico-ITX board, powered by either a 1GHz VIA C7 processor, or an Ultra Low Voltage 500MHz VIA Eden processor coupled with VIA’s VX700 Unified Digital Media chipset, supporting up to 1GB of DDR2 SO-DIMM system memory.
Both DVI-D and VGA outputs are supported through integrated the VIA UniChrome™ Pro II IGP, which also provides MPEG-2/4 and WMV9 hardware acceleration for smooth media playback.
The VIA AMOS-3000 has a certified operating temperature of -20 to 60 degrees C, vibration tolerance of up to 5Grms and a shock tolerance of up to 50G.
Storage is provided through a 44-pin IDE interface for Disk on Module Flash drive - an optional storage sub-system expansion chassis offers support for a standard 2.5” S-ATA drive. An onboard RJ45 connector provides Gigabit networking while the VIA VT1708A brings HD audio. Additional features include 4 USB 2.0 ports, on board GPIO port, COM port and programmable Watchdog Timer. System LED indicators are provided for power and HDD activity.
For more details about the VIA AMOS-3000 please visit:
www.via.com.tw/en/products/embedded/amos-3000/
To learn more about the VIA EPIA-P700 Pico-ITX board please visit:
www.via.com.tw/en/products/mainboards/motherboards.jsp?motherboard_id=690
Please download visual materials at the press release webpage:
www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=3148
About VIA Technologies, Inc.
VIA Technologies, Inc is the foremost fabless supplier of power efficient x86 processor platforms that are driving system innovation in the PC, client, ultra mobile and embedded markets. Combining energy-saving processors with digital media chipsets and advanced connectivity, multimedia and networking silicon enables a broad spectrum of computing and communication platforms, including its widely acclaimed ultra compact mainboards. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs and system integrators. www.via.com.tw
Taipei, Taiwan, 25 February 2009 - VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the launch of VIA’s first embedded box computer; the VIA AMOS-3000. Ideal for a variety of embedded applications, the VIA AMOS-3000 is a robust, custom-designed system based on the ultra compact and versatile VIA EPIA-P700 Pico-ITX board.
Inspired by classical Chinese architecture, the VIA AMOS-3000 chassis combines heavy-duty steel, aluminum and copper in a unique heat fin design that offers superb heat dissipation. Using a total of only five mechanical pieces - top cover, bottom plate, front and rear I/O access plates and DOM module – and measuring only 13.5cm(w) x 4.5cm(h) x 13.1cm(d), the VIA AMOS-3000 is strong, durable and heat efficient, yet tiny enough to fit in the palm of your hand. The VIA AMOS-3000 can be installed easily using simple table, wall and VESA mounting options.
The VIA AMOS-3000 is a complete system that uses no moving parts, making it an excellent choice for mission-critical applications in harsh industrial environments, while the full featured VIA EPIA Pico-ITX board is ideal for a range of x86 applications including gaming, digital signage, industrial automation and in-car entertainment.
“We have drawn on the strength of our engineering expertise in developing our boards and form factors and taken the step of developing our own custom-designed systems. This has allowed us to produce some truly compelling embedded system designs,” said Daniel Wu, Vice President, VIA Embedded Platform Division, VIA Technologies, Inc. “The VIA AMOS-3000 represents the first of many diverse embedded system products based around our own exclusive range of EPIA boards.”
The VIA AMOS-3000 will be on show at Embedded World 2009, March 3-5 at the Exhibition Center Nuremberg, Hall 12, No. 350. For more details about VIA’s involvement at Embedded World 2009 please visit: www.via.com.tw/en/company/events/2009-ew/index.jsp
About the VIA AMOS-3000
The VIA AMOS-3000 is based on a VIA EPIA-P700 Pico-ITX board, powered by either a 1GHz VIA C7 processor, or an Ultra Low Voltage 500MHz VIA Eden processor coupled with VIA’s VX700 Unified Digital Media chipset, supporting up to 1GB of DDR2 SO-DIMM system memory.
Both DVI-D and VGA outputs are supported through integrated the VIA UniChrome™ Pro II IGP, which also provides MPEG-2/4 and WMV9 hardware acceleration for smooth media playback.
The VIA AMOS-3000 has a certified operating temperature of -20 to 60 degrees C, vibration tolerance of up to 5Grms and a shock tolerance of up to 50G.
Storage is provided through a 44-pin IDE interface for Disk on Module Flash drive - an optional storage sub-system expansion chassis offers support for a standard 2.5” S-ATA drive. An onboard RJ45 connector provides Gigabit networking while the VIA VT1708A brings HD audio. Additional features include 4 USB 2.0 ports, on board GPIO port, COM port and programmable Watchdog Timer. System LED indicators are provided for power and HDD activity.
For more details about the VIA AMOS-3000 please visit:
www.via.com.tw/en/products/embedded/amos-3000/
To learn more about the VIA EPIA-P700 Pico-ITX board please visit:
www.via.com.tw/en/products/mainboards/motherboards.jsp?motherboard_id=690
Please download visual materials at the press release webpage:
www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=3148
About VIA Technologies, Inc.
VIA Technologies, Inc is the foremost fabless supplier of power efficient x86 processor platforms that are driving system innovation in the PC, client, ultra mobile and embedded markets. Combining energy-saving processors with digital media chipsets and advanced connectivity, multimedia and networking silicon enables a broad spectrum of computing and communication platforms, including its widely acclaimed ultra compact mainboards. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs and system integrators. www.via.com.tw
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