VIA C7-M ULV Processor Powers New HP 2133 Mini-Note PC
VIA enables the HP Mini to deliver performance and portability to the fast growing student market
Taipei, Taiwan, 8 April 2008 - VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced that the low power VIA C7®-M ULV processor will be used to power the new HP 2133 Mini-Note PC, a sleek and stylish, small form factor notebook targeted at today’s connected student lifestyle, where portability, productivity and affordability are highly prized.
The HP Mini provides all the benefits of a notebook PC in an ultra-compact form factor, enabling students to take notes, research information online, share photos, and effortlessly carry all their homework and personal files around in one tiny device.
“We are delighted that HP has leveraged the leading power efficiency and size of the VIA C7-M ULV processor in the HP 2133 Mini-Note PC,” said Richard Brown, Vice President of Corporate Marketing, VIA Technologies, Inc. “This highly portable ultra mobile notebook is the perfect size for today’s students, and offers all the performance, features and connectivity they require.”
“The HP Mini epitomizes the direction of HP’s growing portfolio of innovative products that are designed to meet customers’ diverse sets of needs,” said Carol Hess Nickels, Director of Business Notebook Marketing, Personal Systems Group, HP. “By leveraging VIA’s processors, we are able to offer students a portable, yet affordable, creative notebook PC that better prepares them to live, learn, and work in an information-rich environment.”
About the VIA C7-M ULV Processor
The VIA C7-M ULV processor is available at speeds from 1.0-1.6GHz with a maximum thermal design power (TDP) of only 3.5 watts, and idle power as low as 0.1 watt, helping to ensure enhanced battery life. It also features a low profile nanoBGA2 package measuring just 21mm x 21mm, enabling designs with drastically reduced weight, size, and thickness.
The VIA C7-M ULV processor delivers rich multimedia performance when paired with the VIA CN896 digital media chipset, which features the VIA Chrome9™ HC integrated graphics processor (IGP) with DirectX® 9.0 support for brilliant 3D graphics, and the Chromotion CE video display engine for a stunning video experience. Warm multi-channel sound is provided through the integrated VIA Vinyl Audio technology.
The VIA C7-M ULV processor is the number one choice for Ultra Mobile Devices with over 30 global design wins, the most on the market today. For more details on the VIA C7-M ULV processor, please visit the VIA website at:
www.via.com.tw/en/products/processors/c7-m_ulv/
About VIA Technologies, Inc.
VIA Technologies, Inc is the foremost fabless supplier of power efficient x86 processor platforms that are driving system innovation in the PC, client, ultra mobile and embedded markets. Combining energy-saving processors with digital media chipsets and advanced connectivity, multimedia and networking silicon enables a broad spectrum of computing and communication platforms, including its widely acclaimed ultra compact mainboards. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs and system integrators. www.via.com.tw
VIA enables the HP Mini to deliver performance and portability to the fast growing student market
Taipei, Taiwan, 8 April 2008 - VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced that the low power VIA C7®-M ULV processor will be used to power the new HP 2133 Mini-Note PC, a sleek and stylish, small form factor notebook targeted at today’s connected student lifestyle, where portability, productivity and affordability are highly prized.
The HP Mini provides all the benefits of a notebook PC in an ultra-compact form factor, enabling students to take notes, research information online, share photos, and effortlessly carry all their homework and personal files around in one tiny device.
“We are delighted that HP has leveraged the leading power efficiency and size of the VIA C7-M ULV processor in the HP 2133 Mini-Note PC,” said Richard Brown, Vice President of Corporate Marketing, VIA Technologies, Inc. “This highly portable ultra mobile notebook is the perfect size for today’s students, and offers all the performance, features and connectivity they require.”
“The HP Mini epitomizes the direction of HP’s growing portfolio of innovative products that are designed to meet customers’ diverse sets of needs,” said Carol Hess Nickels, Director of Business Notebook Marketing, Personal Systems Group, HP. “By leveraging VIA’s processors, we are able to offer students a portable, yet affordable, creative notebook PC that better prepares them to live, learn, and work in an information-rich environment.”
About the VIA C7-M ULV Processor
The VIA C7-M ULV processor is available at speeds from 1.0-1.6GHz with a maximum thermal design power (TDP) of only 3.5 watts, and idle power as low as 0.1 watt, helping to ensure enhanced battery life. It also features a low profile nanoBGA2 package measuring just 21mm x 21mm, enabling designs with drastically reduced weight, size, and thickness.
The VIA C7-M ULV processor delivers rich multimedia performance when paired with the VIA CN896 digital media chipset, which features the VIA Chrome9™ HC integrated graphics processor (IGP) with DirectX® 9.0 support for brilliant 3D graphics, and the Chromotion CE video display engine for a stunning video experience. Warm multi-channel sound is provided through the integrated VIA Vinyl Audio technology.
The VIA C7-M ULV processor is the number one choice for Ultra Mobile Devices with over 30 global design wins, the most on the market today. For more details on the VIA C7-M ULV processor, please visit the VIA website at:
www.via.com.tw/en/products/processors/c7-m_ulv/
About VIA Technologies, Inc.
VIA Technologies, Inc is the foremost fabless supplier of power efficient x86 processor platforms that are driving system innovation in the PC, client, ultra mobile and embedded markets. Combining energy-saving processors with digital media chipsets and advanced connectivity, multimedia and networking silicon enables a broad spectrum of computing and communication platforms, including its widely acclaimed ultra compact mainboards. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs and system integrators. www.via.com.tw
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