VIA Moves into COM Express™ Embedded Module Market
VIA to introduce first COM Express™ modules with VIA processor platform, enabling cost effective, flexible customization and faster time to market
Taipei, Taiwan, April 14th 2008 - VIA Technologies, Inc, a leading innovator and developer of embedded silicon and platform technologies, today announced the extension of embedded board portfolio to include COM Express™ modules that will be the first to harness the power and thermal advantages of VIA’s processor platforms.
Measuring 95mm x 125 mm, COM Express is an industry standard embedded form factor developed by the PICMG (PCI Industrial Computer Manufacturers Group) to provide greater connectivity and data transfer bandwidth than the original COM (Computer-on-Module) standard. The COM Express specification integrates core CPU, chipset and memory on the module, providing support for extensive connectivity options, including USB, audio, graphics, and Ethernet, through board-to-board connectors to an I/O baseboard.
Leveraging VIA’s signature low heat, power-efficient platform silicon, the new fanless VIA COM Express modules will be powered by VIA Eden™ or VIA C7® processors ranging from 500MHz right up to 2GHz. Support for a comprehensive feature set of I/O implementations through VIA’s versatile digital media IGP chipsets, while the option of onboard system memory provides vibration resistance for in-vehicle or heavy plant environments.
VIA COM Express modules are targeted at industrial PC and large OEM customers focused on dynamic application segments, including gaming, healthcare and industrial automation. Customers can take advantage of a proprietary multi-I/O baseboard for evaluation purposes, or can utilize VIA’s extensive technical support in developing a custom baseboard.
“With over six years of experience in small form factor board design and development, our entry into the embedded module market is a natural evolution for us,” said Daniel Wu, Vice President, VIA Embedded Platform Division, VIA Technologies, Inc. “Flexible and modular solutions are an essential expansion of VIA’s embedded platform range, strengthening our commitment to all sectors of the embedded industry.”
The first samples of the VIA COM Express modules are available now for industrial PC and larger OEMs only; for more details, please send an email to the VIA Embedded team at: embedded@via.com.tw
About VIA Technologies, Inc.
VIA Technologies, Inc is the foremost fabless supplier of power efficient x86 processor platforms that are driving system innovation in the PC, client, ultra mobile and embedded markets. Combining energy-saving processors with digital media chipsets and advanced connectivity, multimedia and networking silicon enables a broad spectrum of computing and communication platforms, including its widely acclaimed ultra compact mainboards. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs and system integrators. www.via.com.tw
VIA to introduce first COM Express™ modules with VIA processor platform, enabling cost effective, flexible customization and faster time to market
Taipei, Taiwan, April 14th 2008 - VIA Technologies, Inc, a leading innovator and developer of embedded silicon and platform technologies, today announced the extension of embedded board portfolio to include COM Express™ modules that will be the first to harness the power and thermal advantages of VIA’s processor platforms.
Measuring 95mm x 125 mm, COM Express is an industry standard embedded form factor developed by the PICMG (PCI Industrial Computer Manufacturers Group) to provide greater connectivity and data transfer bandwidth than the original COM (Computer-on-Module) standard. The COM Express specification integrates core CPU, chipset and memory on the module, providing support for extensive connectivity options, including USB, audio, graphics, and Ethernet, through board-to-board connectors to an I/O baseboard.
Leveraging VIA’s signature low heat, power-efficient platform silicon, the new fanless VIA COM Express modules will be powered by VIA Eden™ or VIA C7® processors ranging from 500MHz right up to 2GHz. Support for a comprehensive feature set of I/O implementations through VIA’s versatile digital media IGP chipsets, while the option of onboard system memory provides vibration resistance for in-vehicle or heavy plant environments.
VIA COM Express modules are targeted at industrial PC and large OEM customers focused on dynamic application segments, including gaming, healthcare and industrial automation. Customers can take advantage of a proprietary multi-I/O baseboard for evaluation purposes, or can utilize VIA’s extensive technical support in developing a custom baseboard.
“With over six years of experience in small form factor board design and development, our entry into the embedded module market is a natural evolution for us,” said Daniel Wu, Vice President, VIA Embedded Platform Division, VIA Technologies, Inc. “Flexible and modular solutions are an essential expansion of VIA’s embedded platform range, strengthening our commitment to all sectors of the embedded industry.”
The first samples of the VIA COM Express modules are available now for industrial PC and larger OEMs only; for more details, please send an email to the VIA Embedded team at: embedded@via.com.tw
About VIA Technologies, Inc.
VIA Technologies, Inc is the foremost fabless supplier of power efficient x86 processor platforms that are driving system innovation in the PC, client, ultra mobile and embedded markets. Combining energy-saving processors with digital media chipsets and advanced connectivity, multimedia and networking silicon enables a broad spectrum of computing and communication platforms, including its widely acclaimed ultra compact mainboards. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs and system integrators. www.via.com.tw
MSI MPG Velox 100R Chassis Review
October 14 2021 | 15:04
Want to comment? Please log in.