The Ryzen 9 3950X, Intel's Cascade Lake-X, and AMD's 3rd Gen Threadripper will reshape our perceptions of the CPU market.
We've picked some of the best projects recently completed in our project log forum.
The Cinderblock of cases.
Teases a FinFET transition plan, though.
New APU model uses 20nm node.
Enterprise customers get 20nm first.
Pin-compatible chips to share a motherboard.
16nm finFET process development is going well.
We look at OCZ's new Vertex 450 256GB, based around the same controller as the Vector and with 20nm NAND.
Can Crucial's latest SSD take the mainstream market crown?
240GB model the first on the market.
Uses a hybrid of 14nm and 20nm processes for quick time-to-market.
Applied Materials claims to have solved the problem of creating sub-20nm interconnects.
Qualcomm has become the first of TSMC's 28nm customers to publicly complain of capacity issues.
GlobalFoundries discusses its roadmap, including a move to 3D transistors and gate-last production.
Conceding to the strategies of Intel and TSMC, Global Foundries and IBM go gate-last.
What's AMD spin-off Global Foundries cooking up in its upcoming 32nm, 28nm parts and beyond?
Intel has signed a deal with the Tyndall National Institute in Cork to commercialise chip research.
Hynix has announced mass production of its latest 64Gb 20nm NAND flash chips for SSDs.
ARM has announced a deal with chip fabricator TSMC to produce new 28nm and 20nm chips.
November 13 2019 | 09:50
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