Taking 7nm process technology to new limits.
This Western-themed roguelike has style to spare, but falls short on ideas.
MSI and EK team up to cool the CPU and power delivery on its MPG Z490 Carbon board
Gen2 spec doubles the interface rate.
3D RAM to hit shop shelves soon.
TSV-based 3D DRAM tech heads to production.
Microsoft has joined the Hybrid Memory Cube Consortium, supporting the new HMC RAM technology.
Micron's three-dimensional Hybrid Memory Cube technology has won it an award from The Linley Group.
July 1 2020 | 17:34
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