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Budget in price, mainstream in aspiration.
Gen2 spec doubles the interface rate.
3D RAM to hit shop shelves soon.
TSV-based 3D DRAM tech heads to production.
Spintronics prototype proves concept.
Microsoft has joined the Hybrid Memory Cube Consortium, supporting the new HMC RAM technology.
Micron's three-dimensional Hybrid Memory Cube technology has won it an award from The Linley Group.
October 14 2021 | 15:04
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