How does Asus' new ELMB-Sync feature look in practice?
Taking 7nm process technology to new limits.
Gen2 spec doubles the interface rate.
3D RAM to hit shop shelves soon.
TSV-based 3D DRAM tech heads to production.
Spintronics prototype proves concept.
Microsoft has joined the Hybrid Memory Cube Consortium, supporting the new HMC RAM technology.
Micron's three-dimensional Hybrid Memory Cube technology has won it an award from The Linley Group.
July 1 2020 | 17:34
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