10 articles tagged as through-silicon-via
The end

The end

Time to say goodbye from all of us at bit-tech.net

November 1, 2021 | 14:00
Inscryption Review

Inscryption Review

Welcome challenger. Why not sit down, and play a little game?

October 27, 2021 | 12:05
SilentiumPC Regnum RG6V TG Case Review

SilentiumPC Regnum RG6V TG Case Review

Budget in price, mainstream in aspiration.

October 21, 2021 | 09:43
Samsung boasts of 12-layer 3D-TSV breakthrough

Samsung boasts of 12-layer 3D-TSV breakthrough

Promises 24GB HBM2 chips.

October 7, 2019 | 10:23
Toshiba unveils 1TB TSV-packing BiCS flash chips

Toshiba unveils 1TB TSV-packing BiCS flash chips

Smaller than a postage stamp.

July 11, 2017 | 11:34
Qualcomm to trial new 3D chip tech

Qualcomm to trial new 3D chip tech

Promises an easy route to better SoCs.

December 9, 2013 | 11:05
Micron ships first Hybrid Memory Cubes

Micron ships first Hybrid Memory Cubes

3D RAM to hit shop shelves soon.

September 27, 2013 | 10:10
Hybrid Memory Cube specification gets finalised

Hybrid Memory Cube specification gets finalised

TSV-based 3D DRAM tech heads to production.

April 3, 2013 | 10:38
Cambridge researchers unveil 3D microchip

Cambridge researchers unveil 3D microchip

Spintronics prototype proves concept.

February 4, 2013 | 11:28
Microsoft backs Hybrid Memory Cube tech

Microsoft backs Hybrid Memory Cube tech

Microsoft has joined the Hybrid Memory Cube Consortium, supporting the new HMC RAM technology.

May 9, 2012 | 10:32
GlobalFoundries announces TSV tech on 20nm

GlobalFoundries announces TSV tech on 20nm

GlobalFoundries has announced it will offer through-silicon via (TSV) production at the 20nm node.

April 27, 2012 | 11:08
Invensas to present xFD DRAM breakthrough

Invensas to present xFD DRAM breakthrough

Invensas is to present a new breakthrough in its xFD packaging technology for high-density DRAM.

March 21, 2012 | 11:04
Micron's Hybrid Memory Cubes win tech award

Micron's Hybrid Memory Cubes win tech award

Micron's three-dimensional Hybrid Memory Cube technology has won it an award from The Linley Group.

January 27, 2012 | 14:42
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MSI MPG Velox 100R Chassis Review

October 14 2021 | 15:04