Rick runs down the highlights of the coming year.
Despite huge ambition, Medal of Honor's VR adventure fails to go beyond the Call of Duty.
Bustin' makes me feel good.
Promises 24GB HBM2 chips.
Smaller than a postage stamp.
Promises an easy route to better SoCs.
3D RAM to hit shop shelves soon.
TSV-based 3D DRAM tech heads to production.
Spintronics prototype proves concept.
Microsoft has joined the Hybrid Memory Cube Consortium, supporting the new HMC RAM technology.
GlobalFoundries has announced it will offer through-silicon via (TSV) production at the 20nm node.
Invensas is to present a new breakthrough in its xFD packaging technology for high-density DRAM.
Micron's three-dimensional Hybrid Memory Cube technology has won it an award from The Linley Group.
December 11 2020 | 17:30
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