The nominations are in, it's time to decide who deserves the crown for 2019!
Intel's latest 10-core has received a hefty price cut, but is it worth the cash?
We take a look at Gigabyte's sub-£500 TRX40 board to see if it can compete with the excellent ROG Strix TRX40-E Gaming.
Promises 24GB HBM2 chips.
Smaller than a postage stamp.
Promises an easy route to better SoCs.
3D RAM to hit shop shelves soon.
TSV-based 3D DRAM tech heads to production.
Spintronics prototype proves concept.
Microsoft has joined the Hybrid Memory Cube Consortium, supporting the new HMC RAM technology.
GlobalFoundries has announced it will offer through-silicon via (TSV) production at the 20nm node.
Invensas is to present a new breakthrough in its xFD packaging technology for high-density DRAM.
Micron's three-dimensional Hybrid Memory Cube technology has won it an award from The Linley Group.
January 24 2020 | 12:00
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