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11 articles tagged as tsv

The end

The end

Time to say goodbye from all of us at bit-tech.net

November 1, 2021 | 14:00

Inscryption Review

Inscryption Review

Welcome challenger. Why not sit down, and play a little game?

October 27, 2021 | 12:05

SilentiumPC Regnum RG6V TG Case Review

SilentiumPC Regnum RG6V TG Case Review

Budget in price, mainstream in aspiration.

October 21, 2021 | 09:43

Samsung boasts of 12-layer 3D-TSV breakthrough

Samsung boasts of 12-layer 3D-TSV breakthrough

Promises 24GB HBM2 chips.

October 7, 2019 | 10:23

JEDEC boosts HBM densities, performance

JEDEC boosts HBM densities, performance

JESD235B revision out now.

December 18, 2018 | 10:16

Toshiba unveils 1TB TSV-packing BiCS flash chips

Toshiba unveils 1TB TSV-packing BiCS flash chips

Smaller than a postage stamp.

July 11, 2017 | 11:34

Hybrid Memory Cube performance doubles

Hybrid Memory Cube performance doubles

Gen2 spec doubles the interface rate.

February 26, 2014 | 11:06

Qualcomm to trial new 3D chip tech

Qualcomm to trial new 3D chip tech

Promises an easy route to better SoCs.

December 9, 2013 | 11:05

Micron ships first Hybrid Memory Cubes

Micron ships first Hybrid Memory Cubes

3D RAM to hit shop shelves soon.

September 27, 2013 | 10:10

Hybrid Memory Cube specification gets finalised

Hybrid Memory Cube specification gets finalised

TSV-based 3D DRAM tech heads to production.

April 3, 2013 | 10:38

GTC 2013: Nvidia unveils Volta, Parker and Faceworks tech

GTC 2013: Nvidia unveils Volta, Parker and Faceworks tech

Promises some serious breakthroughs.

March 20, 2013 | 09:39

Microsoft backs Hybrid Memory Cube tech

Microsoft backs Hybrid Memory Cube tech

Microsoft has joined the Hybrid Memory Cube Consortium, supporting the new HMC RAM technology.

May 9, 2012 | 10:32

GlobalFoundries announces TSV tech on 20nm

GlobalFoundries announces TSV tech on 20nm

GlobalFoundries has announced it will offer through-silicon via (TSV) production at the 20nm node.

April 27, 2012 | 11:08

Invensas to present xFD DRAM breakthrough

Invensas to present xFD DRAM breakthrough

Invensas is to present a new breakthrough in its xFD packaging technology for high-density DRAM.

March 21, 2012 | 11:04

Project logs

modding content

Corsair

MSI MPG Velox 100R Chassis Review

October 14 2021 | 15:04

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