And an MM500 mouse pad thrown in for good measure. What's not to like?
An update on the Dark Core, can it pass muster at £100 when equipped with Slipstream technology and greater focus on RGB? We find out.
Rick returns to the best stealth game in existence.
Promises 24GB HBM2 chips.
JESD235B revision out now.
Smaller than a postage stamp.
Gen2 spec doubles the interface rate.
Promises an easy route to better SoCs.
3D RAM to hit shop shelves soon.
TSV-based 3D DRAM tech heads to production.
Promises some serious breakthroughs.
Microsoft has joined the Hybrid Memory Cube Consortium, supporting the new HMC RAM technology.
GlobalFoundries has announced it will offer through-silicon via (TSV) production at the 20nm node.
Invensas is to present a new breakthrough in its xFD packaging technology for high-density DRAM.
April 7 2020 | 14:00
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