This Western-themed roguelike has style to spare, but falls short on ideas.
MSI and EK team up to cool the CPU and power delivery on its MPG Z490 Carbon board
What's the best way to evaluate a game about dismantling spaceships? Break it down.
Promises 24GB HBM2 chips.
JESD235B revision out now.
Smaller than a postage stamp.
Gen2 spec doubles the interface rate.
Promises an easy route to better SoCs.
3D RAM to hit shop shelves soon.
TSV-based 3D DRAM tech heads to production.
Promises some serious breakthroughs.
Microsoft has joined the Hybrid Memory Cube Consortium, supporting the new HMC RAM technology.
GlobalFoundries has announced it will offer through-silicon via (TSV) production at the 20nm node.
Invensas is to present a new breakthrough in its xFD packaging technology for high-density DRAM.
July 1 2020 | 17:34
Copyright © 2000 - 2020, bit-tech.net. All rights reserved.