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Budget in price, mainstream in aspiration.
Promises 24GB HBM2 chips.
JESD235B revision out now.
Smaller than a postage stamp.
Gen2 spec doubles the interface rate.
Promises an easy route to better SoCs.
3D RAM to hit shop shelves soon.
TSV-based 3D DRAM tech heads to production.
Promises some serious breakthroughs.
Microsoft has joined the Hybrid Memory Cube Consortium, supporting the new HMC RAM technology.
GlobalFoundries has announced it will offer through-silicon via (TSV) production at the 20nm node.
Invensas is to present a new breakthrough in its xFD packaging technology for high-density DRAM.
October 14 2021 | 15:04
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