Samsung announces '10nm-class' LPDDR5
Aims at smartphones, AI.
UMC wins early, though temporary, victory.
1-2 percent increase at the wholesale level.
SK Hynix and IBM are to work together on the development of phase-change memory (PCRAM) products.
Researchers at UCL have created the first material which allows ReRAM modules to work at ambient temperatures.
Samsung is targeting consumers in a new advertising campaign for its DRAM and NAND flash products.
Microsoft has joined the Hybrid Memory Cube Consortium, supporting the new HMC RAM technology.
Micron has announced sampling of its first DDR4 modules
G.Skill is planning to launch a modular RAM family dubbed the Trident X Series, apparently inspired by Corsair.
SanDisk has dropped first quarter projections due to overproduction of NAND flash components.
Hynix has announced a deal with SK Group and a new name: SK Hynix.
Invensas is to present a new breakthrough in its xFD packaging technology for high-density DRAM.
Memory maker Elpida has filed for bankruptcy protection as its stock drops 95 per cent on the Tokyo exchange.
Micron president Mark Adams claims that the DRAM market's slump is over, meaning prices will begin to rise.
Patent house Rambus has acquired memory specialist Unity Semiconductor in a bet on the future of SSDs.
Micron's three-dimensional Hybrid Memory Cube technology has won it an award from The Linley Group.
OCZ has bought the UK-based wing of SoC design company PLX.
We gather all the news, gossip, previews and rumours from the most important PC tech show.
Research undertaken by Crucial shows that the average PC has a lifespan of 4.5 years.
$32 million deal sees the two companies link up and share resources.
Scientists unveil a building block for 'universal memory' - DFG-FETs.
OCZ has announced its imminent departure from the DRAM market, and will instead concentrate on SSDs.
Corsair has launched a new line of highly-overclockable RAM: the Vengeance series.
Market watcher DRAMeXchange is expecting prices to drop massively by the end of the year.
OCZ has announced two new RAM series, the performance Blade 2 and low-profile XTE.
German-based memory start-up Exceleram has taken the wraps off its upcoming products.
The Xeon 5600-series is demoed at IDF, with new memory and a new chipset.
HP has teamed up with Hynix to bring its "memristor" technology to market.
Researchers at Rice University have discovered a method for shrinking chips using silicon oxide.